We are looking for a senior technical leader to drive the Back End Physical Design aspects of high-performance compute SOC/MCU development. The candidate must be highly experienced, hands-on and have expert level knowledge on advance technology node back-end physical implementation, SOC convergence, sign-off and tape-out experience on automotive grade SOCs.
Responsibilities:
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’
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Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement.
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Join Renesas as a Backend Physical Implementation Leader in Austin, Texas, where you'll be at the forefront of high-performance compute SOC/MCU development. If you’re a seasoned technical leader with a passion for back-end physical design, this is your chance to shine. You will play a vital role in driving global teams through advanced technology node physical implementation and sign-off processes for automotive-grade SOCs. With a strong focus on continuous improvement, you will enhance methods, tools, and chip development processes, always aiming for the lowest AUC and highest yield quality. Your expertise will be crucial in ensuring that chip KPIs such as power, performance, area, thermal, and schedule commitments are consistently met. Collaborating closely with design enablement, SOC architecture, package, and post-silicon test teams, you'll help meet our NPI and technology goals. If you're open-minded, knowledgeable, and have a proven track record of coordinating cross-functional efforts, this could be the perfect opportunity for you to make an impact in a dynamic environment. At Renesas, we foster a flexible and inclusive workplace where you can advance your career while helping to shape the future of technology. Ready to take on this exciting challenge?
Renesas Electronics Corporation delivers trusted embedded design innovation with complete semiconductor solutions. Renesas provides quality and comprehensive solutions for a broad range of Automotive, Industrial, Home Electronics (HE), Office Auto...
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