Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 0-2 years of relevant experience in package development emphasizing hermetic/ceramic /metal and RAD tolerant / class P plastic package
• Preferred understanding of semiconductor hermetic\plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SPC(Statistical Process Control) and statistical analysis a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’
At Renesas, you can:
Are you ready to own your success and make your mark?
Join Renesas. Shape Your Future with Us.
Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
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Looking to embark on an exciting career as a Package Design Engineer with Renesas in Tempe, Arizona? This is your chance to be a key player in the design and development of innovative packaging solutions for commercial space, aerospace, and high-reliability power devices. At Renesas, we focus on developing hermetic, ceramic, metal, and radiation-tolerant packages, ensuring that our products meet the highest industry standards. You'll collaborate closely with product designers to create detailed package drawings using AutoCAD and participate in evaluating materials and processes for optimal performance. Your analytical skills will shine as you work on design of experiments (DOE) to optimize our processes. Plus, you'll stay at the forefront of technological advancements, continually enhancing your skills in a supportive and dynamic environment. If you have a degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering and a passion for innovation, this opportunity offers a collaborative atmosphere where your ideas can flourish. Together we will make people’s lives easier and continue to push the boundaries of embedded processing technology. Are you ready to join us and shape the future?
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Renesas Electronics Corporation delivers trusted embedded design innovation with complete semiconductor solutions. Renesas provides quality and comprehensive solutions for a broad range of Automotive, Industrial, Home Electronics (HE), Office Auto...
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