Embedded Architect / Manager

Organization & Role

Embedded BSP engineering is part of the Hardware engineering organization. This team develops the embedded board support package for all Teradyne instruments and is involved in key architecture choices to select the processors, OS, tools and network adaptation.

Responsibilities

This position is for an embedded architect that develops embedded solutions for Digital, DC and RF instrumentation used in Teradyne’s Semi test equipment. He/she will lead a multi sited development team of senior and junior engineers as well as serving as a technical lead working with the instrument teams. The candidate will also be responsible for maintaining a secure embedded network on our systems.

Basic Qualifications & Skills

Ideal candidate would have a minimum of 10-15 years of experience in the following areas;
Extensive development experience with embedded Linux on Power PC or ARM processors
Embedded architecture development experience
Experience with different types of Network protocols and interfaces
Experience with development of the Board Support Package (BSP) applications
Familiarity with SW development process
Experience with project leadership
Experience with leading/managing small teams
Knowledge of embedded cyber security

Education

BS/MS EE/CE degree, or related field with a minimum of 10-15 years of experience in embedded architecture development

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