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Circuit Designer and Reliability Scientist

Job Details:

Job Description: 

Do Something Wonderful!

Intel put the Silicon in Silicon Valley. No one else is this obsessed with engineering a brighter future. Every day, we create world changing technology that enriches the lives of every person on earth. So, if you have a big idea, let’s do something wonderful together. Join us, because at Intel, we are building a better tomorrow.

Want to learn more? Visit our YouTube Channel or the links below! 

WHO WE ARE

The IP & Technology Enabling Quality and Reliability organization is committed to advancing circuit reliability. We design specialized test chips to characterize various reliability mechanisms and conduct silicon stress experiments on these chips. Additionally, we gather silicon stress data from complete Analog, IO, and Memory IP test chips. This data is crucial for validating our reliability models through a process known as Sil2Sim, ensuring that our simulations accurately reflect real-world conditions. Our efforts also focus on enabling optimization across power, performance, and reliability, ensuring that Intel products achieve the highest standards of efficiency and dependability. Moreover, we leverage AI and machine learning techniques to conduct reliability risk assessments at the product level. By analyzing silicon stress data from test chips, these advanced technologies help us predict potential reliability risks and optimize product designs and specs accordingly. 

WHO YOU ARE

We are seeking a highly motivated and skilled candidate to join our team for a project focused on reliability characterization and modeling to assess risk on product performance. The ideal candidate will possess a strong background in device physics, digital and mixed signal circuit design, SPICE simulations, and Python coding. This role offers a unique opportunity to contribute to the development of cutting-edge technologies and methodologies that will shape the future of reliability in electronic products. The candidate will be instrumental in driving innovation and ensuring the robustness of our products in diverse performance & thermal environments.

The candidate will play a pivotal role in advancing our understanding and management of transistor and thermal reliability in electronic devices and circuits. The scope of the job encompasses several key areas of research and development, aimed at ensuring product performance and longevity under varying voltage, frequency, and thermal conditions.

Responsibilities include but not limited to:

  • Custom circuit design, pre-Si validation, layout and tape-in of designs targeted to support development of Intel's next generation products.

  • Understand mechanisms that limit reliability of Intel's latest products, define creative approaches to characterize these mechanisms through circuit design on test chips, architect the test chips, and develop design definitions, design schematics and work with layout engineers on implementation.

  • Develop test programs, develop and execute design of experiments, reliability modeling and work with product design and quality and reliability teams for reliability risk assessments.

Behavior skills we are looking for:

  • Excellent problem-solving skills and ability to work independently and collaboratively in a team environment.

  • Strong communication skills for presenting research findings and collaborating with diverse teams.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Applied Physics, Physics, or a related field with 6+ years relevant experience or

Master's degree in Electrical Engineering, Computer Engineering, Applied Physics, Physics, or a related field with 4+ years relevant experience or

PhD in Electrical Engineering, Computer Engineering, Applied Physics, Physics, or a related field with 2+ years relevant experience.

Relevant experience should be with the following:

  • Device physics and digital/mixed signal circuit design.

  • SPICE simulations and Python coding for data analysis and modeling.


Preferred Experience:

  • Experience with FPGA programming using VHDL or Verilog.

  • Proven track record of research and publications in reliability, particularly thermal reliability, is highly desirable.

  • Prior experience in reliability testing and characterization.

  • Strong background in reliability statistics.

  • Familiarity with industry-standard tools and methodologies for reliability assessment.

  • Knowledge of test board design and implementation.

  • Demonstrated ability to innovate and develop new concepts in device and circuit reliability.

  • Reliability modeling using machine learning/AI are an added advantage.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Business group:

The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to deliver purposeful computing experiences that unlock people's potential - allowing each person use our products to focus, create and connect in ways that matter most to them. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.  Find more information about all of our Amazing Benefits here:

https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

Annual Salary Range for jobs which could be performed in the US:

$161,230.00-$227,620.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

Average salary estimate

$194425 / YEARLY (est.)
min
max
$161230K
$227620K

If an employer mentions a salary or salary range on their job, we display it as an "Employer Estimate". If a job has no salary data, Rise displays an estimate if available.

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CULTURE VALUES
Inclusive & Diverse
Rise from Within
Mission Driven
Diversity of Opinions
Work/Life Harmony
Growth & Learning
Transparent & Candid
Customer-Centric
BENEFITS & PERKS
Snacks
Onsite Gym
Family Coverage (Insurance)
Medical Insurance
Dental Insurance
Vision Insurance
Mental Health Resources
Life insurance
Disability Insurance
Health Savings Account (HSA)
Flexible Spending Account (FSA)
Learning & Development
Paid Time-Off
401K Matching
Maternity Leave
Paternity Leave
FUNDING
DEPARTMENTS
SENIORITY LEVEL REQUIREMENT
TEAM SIZE
EMPLOYMENT TYPE
Full-time, hybrid
DATE POSTED
April 24, 2025

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