Job Details:

Job Description: 

Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and a new greenfield site in Ohio.

Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development (TD) team, and FSM fabs. This job requisition is seeking a Failure Analysis and Fault Isolation (FA/FI) Engineer working in our FSM Ireland Analytical Laboratories which operates 24/7. Selected candidate will work in a dynamic team supporting technology development and yield improvement through targeted electrical and physical failure analyses (EFA / PFA).

Team will support both product and test chips, spanning from data analysis and workflow planning, sample preparation, nanoprobing, tester based and static fault isolation, report generation and customer presentation. Engineers may focus on specific modules or cover full analysis flow.

FI/FA Engineers responsibilities include (but are not limited to):

• Review incoming support requests and determine initial failure analysis / fault isolation workflow to identify and visualize root cause.

• Hands on operation of laboratory equipment, such as curve tracing, photon emission microscopy, laser stimulation (OBIRCH), and infrared imaging systems.

• Conduct failure analysis workflows using Ga and plasma FIBs, nanoprobing and sample preparation equipment. Mentor and coordinate workflows with supporting technicians.Interact with Transmission Electron Imaging (TEM) experts to interpret and explain failure root cause.

• Support continual improvement and development of new workstreams and techniques.

• Develop a thorough understanding of upstream and downstream techniques in the lab and work seamlessly with peers of different disciplines to get high quality results with fast throughput time.

• Present results of key analyses to internal and external customers.

Candidate should have the following behavioral skills:

• Demonstrated strength in teamwork, analytical problem solving, and effective oral and written communication skills.

• Inquisitive, desire to learn and expand knowledge in field.

• Ability to work with multi-functional, multi-cultural teams.

• Strong in decision making and problem solving.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Bachelor's degree in science and engineering major with 4+ years' related lab experience

• Ireland candidates minimum Level 8 Bachelors' degree. or

• Masters degree in science and engineering major and 3+ years' related lab experience or

• Ph.D. in science and engineering major with 1+ years' related lab experience.

• and Experience working on silicon die or wafer level fault isolation / failure analysis.

Preferred Qualifications

• Advanced degree (Master's or Ph.D.) in science and engineering major.

• 4+ years' experience in a semiconductor failure analysis laboratory supporting advanced technology node technology development.

• 4+ years' experience with 6T SRAM and logic failure analysis.

• Experience operating fault isolation and failure analysis tools.

• Understanding of FinFET technology architecture.

• Knowledge of wafer fabrication and general microelectronics.

• Knowledge of electrical and physical failure analysis flows for semiconductor.

• Hands on experience operating laboratory equipment.

• Willingness to work Front End or Back End Day Shifts

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

          

Job Type:

Experienced Hire

Shift:

Shift 1 G (Ireland)

Primary Location: 

Ireland, Leixlip

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.