Yield Development Engineer

Job DescriptionThis is a lab hands-on position in which the candidate will be responsible for identifying, evaluating, developing, and implementing new analytical metrologies in support of fault isolation and failure analysis of next generation microelectronic packaging technologies. Candidate will be directly responsible for 2-3 of such metrologies, and interacts remotely with supplier's engineers to debug, optimize, and troubleshoot them as needed; ensures continuous improvements and breakthroughs. As instruments' owner, the candidate will be responsible for the training of multiple users, as well as developing innovative methodologies to accelerate failure identification and failure mechanism understanding of complex microelectronic packages. Provides fault isolation and failure analysis support across electronic packaging platforms by performing advanced applications development to enhance the defect detectability of laboratory' tools suite. Develops measurement recipes to provide quick and accurate inputs to failure analysis engineers, helping resolve issues with yield or product quality impact. The candidate should possess the below behavioral skills: Problem solving, out-of-box thinking. Good communication and decision-making skills. Strong teamwork and planning/time management skills. Capable to deliver under pressure. Capability to work well in ambiguous situations. Mature, self-assured, well organized.QualificationsMinimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: Must have a master or PhD degree in Mechanical Engineering, Engineering Science or related field. Minimum 2 years of experience in Finite Element Analysis (FEA) Modeling using Abacus, Onscale, COMSOL Multiphysics, or similar FEA tool. Minimum 2 years of experience on ultrasound physics, wave propagation in solids and liquids, phase array imaging, or related topics. Minimum 2 years of experience performing hands-on laboratory experimental work. 2 years of experience using non-destructive methods for defect detection. Minimum 1 year of experience with programming (e.g. Python, LabView, MATLAB). Preferred Qualifications 1 year of experience on characterization of material properties. 1 year of experience using machine learning tools and methods for image analysis, such as Tensorflow, Linear Regression, Deep learning models, or similar. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.Inside this Business GroupAs the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.Posting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Working ModelThis role will require an on-site presence.