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FEOL (Front-End-Of-Line) Process Integration Development Engineer

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Job Details:

Job Description:

Fab Sort Manufacturing (FSM) is responsible for producing all Intel silicon using advanced manufacturing processes in facilities across Arizona, Ireland, Israel, and Oregon. In alignment with Intel's IDM2.0 strategy, FSM is expanding operations to meet the demands of both internal and foundry customers, introducing state-of-the-art technologies into high-volume manufacturing. Intel has established the HVM Global Yield organization within FSM to enhance yield operations and facilitate rapid yield ramp-up during early high-volume manufacturing phases, collaborating with the Technology Development team and FSM Fab managers.

This job requisition seeks Front-End-Of-Line (FEOL) Process Integration engineers for the HVM Global Yield organization, reporting to the FEOL Process Integration manager. Selected candidates will collaborate with FEOL integration members, Global Yield teams, fab modules, and TD team members to optimize processes and achieve yield ramp-up in the early production stage, supporting both internal and external customers.

FEOL (Front-End-Of-Line) Integration Development Engineers are responsible for:

Leading engineering projects to execute high-volume manufacturing (HVM) yield roadmaps and achieve performance targets.
Collaborating with Technology Development and Local Yield teams to implement new technologies in production fabs.
Working with FEOL/BEOL Integration, Device, Defect Reduction, and Yield Analysis teams to identify root causes of yield and performance issues and executing mitigation plans within set timelines.
Conducting feasibility studies and experiments to characterize processes and enhance product performance throughout development.
Managing New Product Introductions (NPI) in production fabs and optimizing processes to meet foundry customer specifications.
Partnering with Local Yield teams to improve product yield, quality, performance, and reduce wafer costs.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Bachelor's degree in a relevant science or engineering field, with at least 4 years of experience.
Experience in advanced node semiconductor industry, specifically in FEOL Process Integration; level of experience will influence job grade.
Proficient understanding of Device Physics, with experience in FinFET or Gate-All-Around technology development or high-volume manufacturing.
Familiarity with module processes such as lithography, dry etch, wet etch, CMP, diffusion, implant, thin films, and metrology.
Strong problem-solving skills, self-initiative, and ability to learn independently.
Ability to collaborate effectively with multi-functional and multi-cultural teams.
Excellent communication skills.

Preferred Qualifications:

Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics, or Materials Science; related fields may be considered based on industry experience.
Experience in project/program management and/or as a TFT lead.
Strong interpersonal skills, including the ability to influence and motivate others.
Experience engaging with external foundry customers through technical interactions.
Familiarity with GAA (Gate-All-Around) technology architecture.
Background in new semiconductor technology development. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Job Type:

Experienced Hire

Shift:

Shift 1 (Ireland)

Primary Location:

Ireland, Leixlip

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

Average salary estimate

$90000 / YEARLY (est.)

min

max

$70000K

$110000K

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What You Should Know About FEOL (Front-End-Of-Line) Process Integration Development Engineer, Intel

If you're an experienced FEOL (Front-End-Of-Line) Process Integration Development Engineer looking to make a significant impact in the semiconductor industry, Intel in Leixlip, Ireland, has an exciting opportunity for you. At Intel, we are committed to pushing the boundaries of technology, and our Fab Sort Manufacturing (FSM) division plays a crucial role in that mission. You'll be at the forefront of advanced manufacturing as you collaborate with local yield teams and technology development partners to optimize processes and enhance yield ramp-up for high-volume production. Your responsibilities will include leading engineering projects aimed at executing yield roadmaps and meeting performance targets in the exciting environment of high-volume manufacturing. This isn't just a job; it’s an opportunity to engage in groundbreaking work that directly supports both internal and foundry customers. You'll be tasked with identifying root causes of yield and performance issues, managing New Product Introductions (NPI), and performing feasibility studies to ensure the highest product performance. A Bachelor's degree in a relevant science or engineering field is required, and significant experience in the advanced node semiconductor industry, particularly in FEOL Process Integration, is key. With your ability to think critically, work well in teams, and communicate effectively, you’ll be able to thrive in this dynamic role and contribute to revolutionary semiconductor technologies at Intel.

Frequently Asked Questions (FAQs) for FEOL (Front-End-Of-Line) Process Integration Development Engineer Role at Intel

What are the primary responsibilities of a FEOL Process Integration Development Engineer at Intel?

As a FEOL Process Integration Development Engineer at Intel, your primary responsibilities include leading engineering projects related to high-volume manufacturing yield roadmaps, optimizing processes for product yield and performance, managing New Product Introductions (NPI), and collaborating with cross-functional teams to tackle performance issues and execute mitigation plans effectively.