Cepton (Nasdaq: CPTN), a leading intelligent lidar solution provider, is seeking an Advanced Packaging Process Engineer who is passionate about solving challenges to join us. You'll work in a dynamic, cross-functional, collaborative work environment and design, develop and validate micro-packaging technology and process to enable the integrated solution for high-performance 3D LiDAR product. You will also be responsible for the new process introduction and transition to a volume manufacturing process in order to support automotive and non-automotive customers.
Here at Cepton, we use technology to make some difficult problems become easy and some impossible tasks become feasible. We value one's ability to learn higher than the knowledge one has acquired in the past. We like people who strive to solve a problem in new and creative ways instead of only seeking conventional wisdom, we enjoy solving hard problems together. As we are at the cutting edge of technological advancement, join us if you are willing to work with like-minded people to face the challenges posed by the new era of technology together.
- Responsible for packaging process development from concept development to high volume production for next-generation optoelectronics module, including, but not limited to, die attachment, wire binding, encapsulation, and micro-optics integration and other related process development, process control, and device inspections.
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Work with the module design team to develop processes per product specifications.
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Troubleshoot some complex design & process problems, perform Root Cause Analysis, and plan out and execute experiments to eliminate defectivity.
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Create, conduct, and analyze the Design of Experiments (DOE) for development and sustaining activities.
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Failure analysis on issues, and then recommend and validate the design or process improvement solutions.
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Design and collect experimental data, work on hardware issues, compile and analyze data, and create technical reports on equipment and process engineering challenges.
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Organizing process documentation and process data w/ SPC.
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Coordinate with suppliers and manufacturers to define, implement and validate the process flow and ensure manufacturability.
- Bachelor’s(B.S.) degree in engineering, material science, or physics plus 8+ years of working experience in micro packaging and assembling, semiconductor process, LED/Laser industry, or Master’s(M.S.) plus 4+ years of working experience in the field.
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Hands-on experience with optoelectronic packaging technologies including but not limited to die-to-attach, wire bound, glob tops, encapsulation, and micro-optics integration.
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Experience with encapsulation materials selection and qualification.
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Good knowledge, working experience, and hands-on skill with typical packaging equipment and inspection and metrology tools, e.g., data attachment machine, wire bonding machine, microscope, CMM, etc.
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Familiarity with defect characterization and analytical tools.
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Ability to solve complex problems, take a new perspective on existing solutions, and exercise judgment based on analyzing multiple sources of information.
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Ability to understand technical challenges, plan and execute experiments accordingly, and strong data-driven analytical problem-solving skills.
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Good written and verbal communication. Explains complex or sensitive information clearly; works to build consensus among stakeholders.
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Experience with the micro-machining process is a plus.
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Experience with volume manufacturing environment and contract manufacturing is a plus.
- Opportunities to work with strong industry leaders and opportunities to relocate to Silicon Vallely.
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Competitive compensation package, including stock.
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Comprehensive employee benefits program, including medical, dental, vision, life, disability, and more.
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Paid Times Off and paid holidays
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Bonus Program eligibility.
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401k & Flexible Spending Account.
- Cepton Headquarters – San Jose, CA
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Some local on-site visits to key customers.
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Travel to regional customer sites and to support trade shows & conferences if needed.
Cepton is committed to fair and equitable compensation practices.
The pay range for this role is $110,000-150,000. Actual compensation packages are based on several factors that are unique to each candidate, including but not limited to skill set, depth of experience, certifications, and specific work location. This may be different in other locations due to differences in the cost of labor. The total compensation package for this position may also include an annual performance bonus, stock, benefits and/or other applicable incentive compensation plans.
CEPTON Technologies is an Equal Opportunity Employer
We are an Equal Opportunity Employer and do not discriminate against applicants due to race, ethnicity, gender, veteran status, or on the basis of disability or any other federal, state, or local protected class.
About CEPTON Technologies (www.cepton.com):
CEPTON (Nasdaq: CPTN) is a Silicon Valley innovator of lidar-based solutions for automotive (ADAS/AV), smart cities, smart spaces, and smart industrial applications. With its patented Micro Motion Technology (MMT®), Cepton aims to take lidar mainstream and achieve its vision of safe and autonomous transportation for everyone.
Founded in 2016 and led by industry veterans with decades of collective experience across a wide range of advanced lidar and imaging technologies, Cepton is focused on the mass market commercialization of high performance, high quality lidar solutions. Cepton is headquartered in San Jose, CA and has a center of excellence facility in Troy, MI to provide local support to the OEM and Tier 1-studded Metro Detroit area. Cepton also has a presence in Germany, Canada, Japan, India, and China to serve a fast-growing global customer base.