Job details

Director, Advanced Package Development and Integration

Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. For more information, visit www.amkor.com.

Position Summary

Amkor is currently seeking a Director, Advanced Package Development and Integration for our Tempe, AZ office. The primary function of this position is program management for development of advanced chiplet-based modules such as HDFO (High Density Fan-out) and other advanced IC package constructions for computing, networking and PC client market spaces. This person will be the primary interface with Tier 1 customers and Amkor's leading edge R&D center in South Korea.

Essential Duties and Responsibilities

Drive and coordinate development activities with customers and in conjunction with Amkor's development teams in Korea.
Lead Tier 1 customer interface meetings, discussions and follow-ups during project development.
Coordinate and collaborate with all company resources as are required to execute R&D projects that will exceed all customer requirement.
Manage cross functional teams comprised of design center and characterization resources as well as process development in R&D, to optimize novel designs and to establish design rules for new IC package families.
Manage product management through initial production ramp.

Required Qualifications

This position requires a Bachelor's degree in Engineering (Mechanical, Chemical, or Materials Science); Master's degree is preferred.
12+ years of experience in semiconductor packaging development is required, a minimum of 10 years with a Master's degree.
The qualified candidate will be able to work independently in a global organization with demonstrated experience in IC package process development.
The qualified candidate understands the IC package design environment, and trade-offs associated with package design during package process development for FCCSP and FCBGA packages.
Direct previous product management experience involving off-shore process development is highly desired.
Deep knowledge of IC packaging materials, failure mode and reliability qualification procedures is required.
Excellent written and verbal communication skills needed.
This position requires 20% domestic and 20% international travel.

Preferred Qualifications

Expertise in Fan-out IC Packaging, including Low density (LDFO), and high density (HDFO).
Expertise in large body FCBGA packaging: warpage control, stress management, underfill and TIM materials.
Working knowledge of semi-additive plating chemistries and equipment.
Knowledge of thermal or mechanical simulations and modeling and insight derived from these.
Familiarity with Design of Experiments and Statistical Process Control and adeptness with the creation of product marketing collateral is a plus.

Location:

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.

Amkor Glassdoor Company Review

3.5

Amkor DE&I Review

No rating

CEO of Amkor

Stephen D. Kelley

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By Amkor

Amkor Technology is more than amicable about lending a helping hand with microchip packaging. The company claims a top spot in contract packaging/assembly and testing services for semiconductor manufacturers. Packaging involves dicing semiconducto...

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INDUSTRY

Electronics Manufacturing

TEAM SIZE

10000+

LOCATION

Hybrid, based in Tempe, AZ

DATE POSTED

August 5, 2023