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Optoelectronic Packaging Engineer

Company Overview:
MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 65 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.
MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.


Principal Optoelectronic Packaging Engineer

This position is located in Ann Arbor, MI. This facility produces our APD and PIN photodetector semiconductors, as well as high performance packaged opto-electronic assemblies. The role of this position will be in the packaged optoelectronics development team. This team specializes in utilizing MACOMs wide portfolio of components (including lasers, photodiodes, Si Photonics, amplifiers, and other components) and incorporates them into novel solutions for a variety of industries and package styles with a focus on high-frequency RF applications. This position will be responsible for the package design. Through this process they will collaborate with RF, optical, and semiconductor device engineers to create the package concept, simulate the performance under operating conditions, work with vendors to procure components, and qualify the final design to customer requirements.

Roles and Responsibilities:


  • Design of novel opto-electronic packaging solutions for use in demanding space/aerospace applications
  • Simulation of package designs to verify integrity of optical path over thermal and mechanical stresses
  • Evaluation of reliability and manufacturability of the design under military and space standards
  • Collaborate with multidisciplinary engineering team in the development of new products
  • Assist with documentation and manufacturing support during the release of new products
  • Note: this is a non-exhaustive list of duties and responsibilities. Other tasks will be assigned during the course of your employment

Job Qualifications:

  • PhD or MS in Engineering, Physics, or equivalent discipline
  • 5-10 years of experience with the design of opto-electronic assemblies
  • Expertise in optoelectronic packaging, optomechanical design, assembly process, and test methods
  • Experience with packaging in aerospace, mil, or other applications that require robust package design
  • Thorough understanding of both optical and RF interfaces and their requirements
  • Capability to model of package concepts, including thermal, mechanical, and optical simulations.
  • Experience with COMSOL or similar Multiphysics platform desirable

Other Skills:

  • Excellent spoken and written English
  • Strong planning and organizational skills
  • Strong Analytical skills
  • Ability to work within a team environment
  • Ability to work on own initiative

EEO:
MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.

Reasonable Accommodation:
MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process please call +1-978-656-2500 or email HR_Ops@MACOM.com. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.

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CEO of MACOM
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Steve Daly
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MACOM is a new breed of analog semiconductor company—one that delivers a unique combination of high growth, diversification and high profitability. We are enabling a better-connected and safer world by delivering breakthrough semiconductor technol...

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DATE POSTED
June 10, 2023

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