Package Design Engineer

Job Description:

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• All aspects of package design planning at Silicon, interposer and substrate level for multi-chip SiP packaging, including design feasibility, pre/post silicon bring up, and support yield improvement activities, qualification, failure analysis, and system implementation
• All aspects of package design/layout based on Si I/O, Si PI and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing
• Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC designers to develop a portfolio of packages that meets a huge range of performance design points, while optimizing re-use in other Celestial AI products
• Meeting specifications for high-speed interfaces such as HBM, DDR, PCIE and 56G/112G SerDes
• Supporting activities related to production and assembly of IC packages with OSAT and substrate suppliers
• Work with cross-functional teams and support package integration and architecture efforts with vendors
• Actively participate in qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability
• Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI

QUALIFICATIONS:

• BS/MS/PhD in EE/ECE/MSE/ME/ChemE or related disciplines
• 10+ years of experience in Semiconductor Packaging Design, with at least 6 years of hands-on experience in Advanced Package design
• Extensive experience working with advanced packaging tools such as Cadence APD
• Experience working with MCAD tools such as SolidWorks, AutoCAD and interconversion of package design databases to MCAD files
• Knowledge and insights to deliver high density/high performance interconnects in various 2.5D/3D package form factors including InFO, CoWoS, FoCoS and EMIB
• Good understanding of cross-functional packaging areas: Si floor plan, package and board level layout and architecture, design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, reliability, and cost
• Familiarity with component & system level reliability, testing, and FA
• Familiarity with photonics packaging is a plus but not necessary
• Experience in project management and communicating technical and project/program status and issue resolution at all levels of the engineering organization
• Excellent problem-solving skills with strong fundamentals in science, sound engineering judgment, and analytical ability
• Effective communicator and comfortable engaging with internal cross functional teams as well as domestic and overseas suppliers
• Excellent attention to detail, process and operationally oriented and self-driven with the ability to work independently and take projects to completion with minimum supervision

For California location:

As an early startup experiencing explosive growth, we offer an extremely attractive total compensation package, inclusive of competitive base salary and a generous grant of our valuable early-stage equity. The target base salary for this role is approximately $135,000.00 - $180,000.00. The base salary offered may be slightly higher or lower than the target base salary, based on the final scope as determined by the depth of the experience and skills demonstrated by candidate in the interviews.

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