MTS/SMTS/DMTS - Advanced Packaging Integration

The MTS/SMTS/DMTS position at Micron Technology focuses on leading Advanced Packaging Technology Development Projects. Responsibilities include developing Project Program documents, coordinating core teams for 2.5D/3D packages, and ensuring technology integration for test chip development projects. You will also play a critical role in interfacing with multi-functional teams to bring products to mass production, thereby ensuring that Micron's innovative products meet customer needs.

To qualify for the MTS/SMTS/DMTS position at Micron, you will need a Master's or Ph.D. in fields such as Electrical Engineering or Materials Science. Additionally, 7 years of relevant experience in interpreting package and system level designs, along with at least 3 years of experience in communicating technical concepts to leadership is crucial. Your ability to solve problems and work collaboratively will also be essential in this role.

For the MTS/SMTS/DMTS role at Micron Technology, preferred qualifications include 3 years of experience with 2.5D/3D heterogeneous integration technologies like CoWoS and InFO. Moreover, 7 years of experience in wafer bumping and package assembly, as well as a strong understanding of the product development lifecycle, will help set you apart as a candidate. Your technical expertise in these areas will be key to driving project success.

At Micron Technology, the work environment for the MTS/SMTS/DMTS role is dynamic and collaborative. You will be working alongside experts from a variety of fields, including product development and manufacturing. The culture here emphasizes teamwork and innovation, making it a perfect spot for those looking to contribute to cutting-edge technologies that redefine the semiconductor industry.

Micron Technology offers a comprehensive benefits package designed to support the wellbeing and professional growth of its employees. This includes a variety of medical, dental, and vision plans, a robust paid time-off program, and financial protection programs. Micron values its employees, recognizing that your health, work-life balance, and future are important, making this role even more rewarding.

To ensure that Advanced Packaging projects meet timelines and performance targets, I stress the importance of proactive communication and thorough planning. I work closely with multi-functional teams to identify potential roadblocks early and implement solutions. Regularly reviewing milestones and adjusting project timelines as needed keeps everyone aligned and accountable.

Certainly! I have worked extensively with 2.5D/3D heterogeneous integration technologies, particularly with methods like CoWoS and SoIC. My role involved overseeing the integration processes to ensure manufacturability and reliability. I focus on optimizing designs and exploring innovative materials that enhance performance while meeting all necessary specifications.

When interacting with senior leadership, I prioritize clarity and confidence in communicating technical concepts. I present complex information in an understandable manner, often using visual aids or models to demonstrate potential outcomes. I also remain open to feedback and suggestions, which fosters a collaborative atmosphere.

In a previous project, we encountered unforeseen issues regarding package manufacturability that threatened our timeline. I organized a focused team meeting to brainstorm potential solutions and implemented a DFM checklist to address the issues methodically. It required cross-team collaboration, but we effectively devised alternative strategies that kept us on track.

My process for ensuring Design for Reliability (DFR) starts with interdisciplinary collaboration during the design phase to identify reliability requirements and testing standards. I advocate for continuous validation through design reviews and prototype testing, adjusting designs based on results to minimize risks before mass production.

Staying updated with advancements in packaging technologies is crucial for my role. I regularly attend industry conferences, subscribe to relevant publications, and engage in professional networks. Additionally, I participate in continuous learning opportunities to understand emerging trends that can influence our product development at Micron.

I use a combination of structured meetings and informal check-ins to drive collaboration between teams. This fosters open communication, where everyone can share insights and updates regarding the development process. I also utilize collaborative tools to maintain transparency and track progress across all departments involved.

Handling tight deadlines involves prioritizing tasks effectively and keeping communication channels open. I focus on maintaining high-quality standards by implementing rigorous checks at each stage of development, allowing us to meet deadlines without compromising on the final product’s integrity.

I believe the future of Advanced Packaging lies in even greater integration and miniaturization. As we strive for higher efficiency and performance in computing architectures, innovations like chiplets and multi-die packages will play a pivotal role. Staying ahead in research will be vital to adapt to this evolving landscape.

For the MTS/SMTS/DMTS position, strong technical skills in engineering, particularly related to design and simulation, are crucial. However, equally important are soft skills such as effective communication and problem-solving capabilities, as these foster collaboration and drive successful project outcomes.