R&D Senior PCB Layout Development Engineer

As an R&D Senior PCB Layout Development Engineer at Bosch Cross-Domain Computing Solutions, you'll be responsible for updating PCB layouts, conducting feasibility studies, creating detailed layouts with complex circuitry, and collaborating with design teams to resolve issues. You'll also maintain documentation and proprietary tools, ensuring our engineering practices are aligned with the latest trends in technology.

To qualify for the R&D Senior PCB Layout Development Engineer role at Bosch, you should possess a degree in Electrical and Electronic Engineering and have 3-5 years of relevant experience. Familiarity with EDA design tools such as Zuken and Cadence, alongside proficiency in technical report writing and concepts such as FMEA and DFMA, is essential.

The R&D Senior PCB Layout Development Engineer at Bosch plays a pivotal role in driving innovation by designing and optimizing high-complexity PCB layouts. This contributes to the advancement of technologies in driver assistance and automated driving, supporting the broader goal of digitalization in vehicles and enhancing overall system performance.

In your role as an R&D Senior PCB Layout Development Engineer at Bosch, you'll utilize EDA design tools like Zuken and Cadence, along with performing PCB layout documentation and creating Gerber files for fabrication. Additionally, your role may involve programming with scripts such as Perl and engaging with high-speed PCB design technologies.

Bosch offers numerous opportunities for professional development for R&D Senior PCB Layout Development Engineers, including participation in technical forums, exhibitions, and continuous improvement activities. This encourages staying current with the latest technological advancements and enhances your skills, contributing to both personal and professional growth.

Absolutely! Discuss specific projects where you utilized tools like Zuken or Cadence, highlighting the challenges you faced and how you overcame them. Emphasize your familiarity with high-speed PCB designs and any innovative approaches you implemented.

Provide a systematic approach to troubleshooting, starting from identifying the issue through analysis, making necessary adjustments, and verifying the results. Mention collaboration with other engineers as a key part of this process.

Explain your process for conducting feasibility studies, including how you assess aspects like packaging, manufacturability, and overall system performance, showcasing your analytical skills and attention to detail.

Use the STAR method to detail a specific situation where you faced a complex PCB layout issue, how you approached it, and the successful outcome achieved through your efforts.

Discuss any specific projects where you worked with high-speed circuitry, detailing the challenges and the techniques you employed, along with the impact your work had on project outcomes.

Share your methods for staying informed about industry trends, such as attending relevant exhibitions, reading technical journals, or engaging in online forums and discussions.

Emphasize the importance of collaboration in engineering, providing examples of successful team projects and how effective communication led to better design outcomes.

Discuss your organizational skills, mentioning tools or methods you use to prioritize tasks effectively and ensure deadlines are met while maintaining quality.

Detail a specific instance where you employed problem-solving tools such as FMEA, 8D, or QFD, explaining the context, your approach, and the result.

List the languages you speak, emphasizing how being proficient in additional languages like Mandarin can facilitate communication in a diverse team environment, particularly with global counterparts.