General Description:
This engineering opportunity requires working within a multidisciplinary team. The candidate should feel enthusiastic about working in a class 10 cleanroom or similar lab environment daily for 80% of the time. The individual will be responsible for implementation and/or overseeing various wafer microfabrication processing steps. This includes preparing detailed and accurate work flow instruction as well as performing various levels of inspection. In addition, they will be required to learn and operate a state-of-the-art precision die bonder in a proficient manner. They will be expected to acquire sufficient understanding for executing fine-alignment D2D or D2W bonding with high yield within a 2-3 month period.
Essential Duties:
Create process flow with detailed instruction to support new technology development.
Safely handle semiconductor substrates ranging from few millimeter dies to 100mm wafers.
Wafer- and die-level inspection using a variety of inspection and metrology tools such as optical microscope, SEM, profilometer, AFM, etc.
Safely and consistently operate high accuracy semiconductor bonding tools.
Collect and organize process data, perform data analysis and present weekly summary to the team.
Clear daily communication with the project lead and the team
Required Skills:
Hands-on semiconductor wafer processing experience with silicon and/or III-V substrates. This requires sufficient knowledge of microfabrication processing steps such as photolithography, thin film deposition, dry etch, etc.
CAD and mask layout, competent in general physics as well as basic knowledge of electronic circuit theory, experience with operating high precision die bonder or similar, enthusiastic about reading and understanding scientific/engineering journals for application to assigned job duties.
Required Education:
Education: BS (minimum) or MS degree in an engineering field (electrical, mechanical, chemical or material science)
Experience: 1-3 years of microfabrication cleanroom experience
Special Requirements:
Must be a US citizen (no dual citizenship), and be willing to obtain security clearance (secret or top secret)
Compensation:
The base salary range for this full-time position $76,530 - $93,320 + bonus + benefits.
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Are you ready to jump into an exciting role as a Process Integration Engineer at our innovative company in beautiful Malibu, CA? Here, working within a vibrant multidisciplinary team is not just an everyday job; it’s a chance to be at the forefront of cutting-edge technology and advancement in semiconductor processing. This hands-on position will immerse you in a class 10 cleanroom environment for a major part of your day, ensuring that you remain engaged and challenged! Your role will focus on guiding and implementing wafer microfabrication processes, where every detail counts. From crafting precise workflow instructions to performing in-depth inspections using various tools such as SEM and AFM, your influence will shape new technology developments. You’ll also get to operate a state-of-the-art precision die bonder, enhancing your skill set with fine-alignment techniques in a matter of months. Daily communications with your project lead and teammates will ensure clarity in goals and expectations, while you'll enjoy analyzing and presenting data to support continuous improvement. If you’re passionate about semiconductor technologies and eager to contribute to groundbreaking projects, we want you to help us elevate our manufacturing processes!
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