Senior Package Design Engineer

As a Senior Package Design Engineer at Astera Labs, your primary responsibilities include designing package substrates independently from definition to tape-out, optimizing performance, and ensuring manufacturability. You'll also conduct DRC/DRV/LVS/DFM checks, perform design reviews, and generate all necessary documentation for package design.

To qualify as a Senior Package Design Engineer at Astera Labs, you’ll need a BS or MS degree in Engineering, ideally in Electrical, Mechanical, Materials Science, or Physics. Additionally, a minimum of 5 years of experience with Cadence APD/SIP, particularly in large FCBGA/FCCSP package design, is essential.

Success as a Senior Package Design Engineer at Astera Labs requires proficiency in Cadence APD/SIP, solid understanding of BGA package BOM, complementary skills in SI/PI, and the ability to prioritize tasks in a dynamic environment. Strong collaboration and communication skills are also vital, as you'll work closely with cross-functional teams.

At Astera Labs, the salary range for a Senior Package Design Engineer is between USD 175,000 and USD 195,000. Your actual base salary will be determined based on your experience, location, and the pay of employees in similar positions within the company.

A Senior Package Design Engineer at Astera Labs has numerous growth opportunities, including advancing skills in package design methodologies, contributing to innovative projects in AI and cloud connectivity, and potential leadership roles as you gain experience within our vibrant and inclusive team.

When answering this question, focus on specific projects where you've utilized Cadence APD, highlighting your role in package design and any challenges you overcame. Discuss how your proficiency contributed to the success of those projects.

Talk about your methodology for performance optimization, including any specific tools or techniques you use. Emphasize the importance of simulation results and how you integrate them into design adjustments.

In your response, outline your steps for conducting thorough design reviews, including preparation, checklist criteria, and how you incorporate team feedback into final designs. Mention any tools you use for analysis.

Discuss your approach to considering manufacturability during the design process. Include details about the checks you perform and your understanding of the manufacturing process that inform your design decisions.

Provide specific examples of your work with BGA package technology, detailing any relevant projects. Highlight your understanding of BOM, stack-ups, and how you optimize designs for high-speed performance.

Share your time management strategies, including how you assess priorities and stay organized in a fast-paced setting. Talk about any tools you use for tracking progress on multiple tasks.

Choose a relevant challenge and describe the context, the steps you took to overcome it, and the outcome. Emphasize your problem-solving skills and ability to adapt quickly.

Discuss your experience collaborating with various teams, focusing on communication methods and conflict resolution strategies. Highlight a successful project that benefited from effective cross-team collaboration.

Explain your knowledge of package reliability testing, including types of tests you’ve conducted and how the results influenced your design adjustments. Highlight your understanding of failure analysis.

Share your insights on emerging trends and technologies in package design. Discuss how you keep current with industry advancements and how these innovations can be implemented effectively in future projects.