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Packaging Customer Engineer

Job Details:

Job Description: 

Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.

The IFS Packaging and Test Business Group

Packaging is a critical revenue enabler for IFS and a key part of Intel's forward-looking strategy. IFS Packaging Test Business Group has been created to develop, grow, and execute a robust packaging roadmap.

The primary responsibilities for the Packaging Customer Engineer will include but are not limited to:

  • Collaborate with IFS Customer product design, internal product design, Silicon process development, Intel's Assembly Test Technology Development (ATTD), and Product Engineering teams to drive product architecture definition, product package design and execution.
  • Serve as the engineering interface to IFS Customers for packaging services to promote Intel packaging technologies, to perform technical feasibility and risk assessments, to analyze product ask vs. the ATTD packaging roadmap and to close the deal with the customer.
  • Drive Customer-facing technology reviews as the key engineering interface between the Customer and Intel Foundry, owning the Customer packaging engineering relationship from product concept through product mass production.
  • Work with IFS Business Development, ATTD, ATM and Supply Chain to complete RFQ risk assessments and pricing assessments.
  • Capture customer feedback and competitive trends that can better inform the ATTD packaging roadmap.
  • Represent the customer in internal technology working groups for new technologies during pathfinding and development.

This position deals with a high level of both technology and market/business ambiguity and future uncertainties. In addition, this person will be frequently interacting and making recommendations to Intel VPs and Corporate VPs and will need to be conversant and knowledgeable in both internal roadmaps and external industry trends.

In this role you will need the following attributes:

  • Strong problem solving, analytical, and communication skills.
  • Have demonstrated the ability to plan and manage projects.
  • Extensive knowledge of Intel packaging development and manufacturing capabilities.
  • Experience in ATTD and Competitor packaging roadmaps.
  • Experience with product architecture floor plans, IP development cycles, and their dependency on package design and architecture.
  • Be able to work independently in a highly matrixed structure with extensive experience presenting to Senior Management (VP and Corporate VP Level).

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Job posting details (such as work model, location, or time type) are subject to change.

Minimum Qualifications

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science or in a STEM related field of study.
  • 9+ years of experience in packaging, with emphasis on Intel's packaging offerings.
  • Experience with power delivery, high speed signaling, thermal mechanical analysis, process development, or die disaggregation architectures.
  • Experience presenting to external customers/suppliers.

Preferred Qualifications:

  • Post Graduate degree in Electrical Engineering, Computer Engineering, Computer Science or in a STEM related field of study.
  • Mandarin Fluency is a plus

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Arizona, Phoenix

Additional Locations:

US, California, Folsom

Business group:

Intel Foundry is dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. As stewards of Moore's Law, we innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era. This position is part of the Foundry Services business unit within Intel Foundry, a customer-oriented service organization that is dedicated to the success of its customers with full P&L responsibilities. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.  Find more information about all of our Amazing Benefits here:

https://jobs.intel.com/en/benefits

Annual Salary Range for jobs which could be performed in the US:

$186,070.00-$262,680.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

Average salary estimate

$224375 / YEARLY (est.)
min
max
$186070K
$262680K

If an employer mentions a salary or salary range on their job, we display it as an "Employer Estimate". If a job has no salary data, Rise displays an estimate if available.

What You Should Know About Packaging Customer Engineer, Intel

If you're looking to jump into an exciting role, the position of Packaging Customer Engineer at Intel Foundry in Phoenix, Arizona, might just be the perfect fit for you! At Intel, we're on a mission to revolutionize the semiconductor industry with our cutting-edge silicon process and packaging technology—especially as we embrace the era of artificial intelligence. As a Packaging Customer Engineer, your day-to-day activities will include collaborating with various teams such as IFS Customer product design and Silicon process development to craft exceptional product architecture and package designs. You will act as the engineering liaison for our customers while promoting Intel's innovative packaging technologies. Not only will you conduct technical feasibility assessments, but you will also analyze product needs against our ATTD packaging roadmap to make sure we hit the mark! Additionally, you will represent our customers in tech reviews and internal discussions, ensuring their needs are front and center in our designs. This role demands strong analytical and problem-solving skills while also requiring the ability to present effectively to senior management. If you have a Bachelor's degree in Electrical Engineering or a related field, with a solid nine years of experience in packaging, we’d love to hear from you. At Intel, we value creativity and independent work, especially in our matrixed environment. Join us, and let’s shape the future together!

Frequently Asked Questions (FAQs) for Packaging Customer Engineer Role at Intel
What are the primary responsibilities of the Packaging Customer Engineer at Intel Foundry?

The Packaging Customer Engineer at Intel Foundry is responsible for collaborating with IFS customer product and internal design teams, performing technical feasibility assessments, and managing customer packaging relationships from concept through mass production. This role also includes analyzing packaging risks and customer feedback to help shape Intel’s packaging roadmap. Essentially, you’ll be the key link between engineering and our customers, ensuring their needs are met every step of the way!

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What qualifications are needed for the Packaging Customer Engineer position at Intel Foundry?

To be considered for the Packaging Customer Engineer role at Intel Foundry, candidates must have a Bachelor's degree in Electrical Engineering, Computer Engineering, or a related STEM field, along with at least 9 years of experience in packaging, particularly involving Intel's offerings. Experience with power delivery, high-speed signaling, and presenting to external customers is also advantageous, laying the groundwork for a successful career in this pivotal role.

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How does Intel Foundry support career development for Packaging Customer Engineers?

At Intel Foundry, career development is a key focal point for our employees, including Packaging Customer Engineers. We offer various paths for advancement, continuous learning opportunities, on-the-job training, and mentorship from experienced executives. The hybrid work model allows for a balance of in-office and remote work, fostering both professional growth and personal well-being.

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What skills are crucial for success as a Packaging Customer Engineer at Intel Foundry?

Success as a Packaging Customer Engineer at Intel Foundry hinges on strong problem-solving and analytical skills, excellent communication abilities, and an extensive understanding of Intel’s packaging development and technologies. The role requires you to manage multiple projects simultaneously, so project management skills are also essential. Being a strategic thinker who can navigate both technical and market uncertainties will set you apart in this dynamic role.

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What is the work culture like for a Packaging Customer Engineer at Intel Foundry?

The work culture at Intel Foundry emphasizes collaboration, innovation, and a focus on customer success. As a Packaging Customer Engineer, you will be part of diverse teams that foster creativity and encourage new ideas. The inclusive environment promotes open communication and gives employees the autonomy to take initiatives, all while working towards transforming the semiconductor industry.

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Common Interview Questions for Packaging Customer Engineer
What experience do you have that makes you a strong candidate for the Packaging Customer Engineer position?

In responding to this question, highlight your relevant experience in packaging technology, especially with Intel's offerings. Mention specific projects you’ve worked on, emphasizing your collaborative work with cross-functional teams that led to successful product launches. Draw connections between your expertise and the responsibilities outlined in the job description to demonstrate your fit for the role.

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How do you approach problem-solving in high-pressure situations?

Businesses want to know that you can handle stress effectively. Share a specific instance where you successfully managed a challenging situation related to packaging design or customer needs. Explain your systematic approach to identifying the problem, analyzing possible solutions, and implementing a plan—revealing your calmness and analytical skills during high-stakes scenarios.

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Can you describe your familiarity with packaging technologies and market trends?

Discuss your experience with various packaging technologies, particularly those relevant to Intel. Highlight any research you've conducted on market trends, including competitor analysis and customer feedback. This not only shows your knowledge but also your commitment to staying informed and adapting strategies according to industry shifts.

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How would you handle a disagreement with a customer regarding their packaging requirements?

It's essential to show that you can maintain professionalism in challenging situations. Describe your approach to listening to the customer's concerns, clarifying their requirements, and collaborating toward a mutually beneficial solution. Emphasize your communication skills and ability to navigate complex conversations effectively.

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What project management methods do you usually implement?

Employ this question to discuss your experience with project management tools and methodologies, such as Agile or Lean. Provide an example of how you utilized these methods to deliver a project on time while managing multiple stakeholders. This will showcase your organizational skills and ability to work within a matrixed structure.

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What motivates you in your role as a Packaging Customer Engineer?

Share your passion for technology and innovations in the semiconductor industry, along with your commitment to delivering exceptional customer service. Discuss how successfully bringing customer ideas to life excites you and drives your performance. This demonstrates alignment with Intel Foundry’s mission.

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What do you consider your greatest achievement in your previous packaging roles?

When answering this question, choose a significant accomplishment that aligns with the responsibilities of the Packaging Customer Engineer role. Discuss the challenges faced, the innovative solutions you devised, and the positive results achieved. This not only reflects your capabilities but also showcases your impact in previous positions.

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How do you ensure collaboration across different teams?

Emphasize the importance of open communication and regular updates within collaborative projects. Share specific tools or techniques you use to facilitate teamwork, such as project management software or regular check-ins. Showcasing your proactive approach implies you value teamwork and understand the significance of diverse input.

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What do you know about Intel Foundry's position in the semiconductor industry?

This question tests your research about Intel Foundry. Discuss its mission to transform the semiconductor industry, focusing on its innovative technologies, partnerships, and commitment to nurturing customer relationships. Highlighting your understanding of the company's role amidst current market trends demonstrates your interest in becoming part of their journey.

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How do you keep abreast of developments in packaging technology?

To answer effectively, share your strategies for staying informed, such as attending conferences, participating in online forums, or subscribing to industry publications. Highlight any proactive steps you've taken to integrate new trends into your work. This conveys your passion for ongoing learning and commitment to technological advancement.

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MATCH
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BADGES
Badge ChangemakerBadge Diversity ChampionBadge Flexible CultureBadge Global CitizenBadge Work&Life Balance
CULTURE VALUES
Inclusive & Diverse
Rise from Within
Mission Driven
Diversity of Opinions
Work/Life Harmony
Growth & Learning
Transparent & Candid
Customer-Centric
BENEFITS & PERKS
Snacks
Onsite Gym
Family Coverage (Insurance)
Medical Insurance
Dental Insurance
Vision Insurance
Mental Health Resources
Life insurance
Disability Insurance
Health Savings Account (HSA)
Flexible Spending Account (FSA)
Learning & Development
Paid Time-Off
401K Matching
Maternity Leave
Paternity Leave
FUNDING
DEPARTMENTS
SENIORITY LEVEL REQUIREMENT
TEAM SIZE
EMPLOYMENT TYPE
Full-time, hybrid
DATE POSTED
April 2, 2025

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