Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.
The IFS Packaging and Test Business Group
Packaging is a critical revenue enabler for IFS and a key part of Intel's forward-looking strategy. IFS Packaging Test Business Group has been created to develop, grow, and execute a robust packaging roadmap.
The primary responsibilities for the Packaging Customer Engineer will include but are not limited to:
This position deals with a high level of both technology and market/business ambiguity and future uncertainties. In addition, this person will be frequently interacting and making recommendations to Intel VPs and Corporate VPs and will need to be conversant and knowledgeable in both internal roadmaps and external industry trends.
In this role you will need the following attributes:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Job posting details (such as work model, location, or time type) are subject to change.
Minimum Qualifications
Preferred Qualifications:
Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
https://jobs.intel.com/en/benefits
Annual Salary Range for jobs which could be performed in the US:
$186,070.00-$262,680.00Salary range dependent on a number of factors including location and experience.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.If an employer mentions a salary or salary range on their job, we display it as an "Employer Estimate". If a job has no salary data, Rise displays an estimate if available.
If you're looking to jump into an exciting role, the position of Packaging Customer Engineer at Intel Foundry in Phoenix, Arizona, might just be the perfect fit for you! At Intel, we're on a mission to revolutionize the semiconductor industry with our cutting-edge silicon process and packaging technology—especially as we embrace the era of artificial intelligence. As a Packaging Customer Engineer, your day-to-day activities will include collaborating with various teams such as IFS Customer product design and Silicon process development to craft exceptional product architecture and package designs. You will act as the engineering liaison for our customers while promoting Intel's innovative packaging technologies. Not only will you conduct technical feasibility assessments, but you will also analyze product needs against our ATTD packaging roadmap to make sure we hit the mark! Additionally, you will represent our customers in tech reviews and internal discussions, ensuring their needs are front and center in our designs. This role demands strong analytical and problem-solving skills while also requiring the ability to present effectively to senior management. If you have a Bachelor's degree in Electrical Engineering or a related field, with a solid nine years of experience in packaging, we’d love to hear from you. At Intel, we value creativity and independent work, especially in our matrixed environment. Join us, and let’s shape the future together!
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