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FE Process Integration Engineer

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Job Details:

Job Description:

Fab Sort Manufacturing (FSM) is responsible for producing all Intel silicon using advanced manufacturing processes.

In alignment with Intel's IDM2.0 strategy, FSM is expanding operations to meet the demands of both internal and foundry customers, introducing state-of-the-art technologies into high-volume manufacturing.

Intel has established the HVM Global Yield organization within FSM to enhance yield operations and facilitate rapid yield ramp-up during early high-volume manufacturing phases, collaborating with the Technology Development team and FSM Fab managers.

This job requisition seeks Front-End-Of-Line (FEOL) Process Integration engineers for the HVM Global Yield organization, reporting to the FEOL Process Integration manager.

Selected candidates will collaborate with FEOL integration members, Global Yield teams, fab modules, and TD team members to optimize processes and achieve yield ramp-up in the early production stage, supporting both internal and external customers.

FEOL (Front-End-Of-Line) Integration Development Engineers are responsible for:

Leading engineering projects to execute high-volume manufacturing (HVM) yield roadmaps and achieve performance targets.
Collaborating with Technology Development and Local Yield teams to implement new technologies in production fabs.
Working with FEOL/BEOL Integration, Device, Defect Reduction, and Yield Analysis teams to identify root causes of yield and performance issues and executing mitigation plans within set timelines.
Conducting feasibility studies and experiments to characterize processes and enhance product performance throughout development.
Managing New Product Introductions (NPI) in production fabs and optimizing processes to meet foundry customer specifications.
Partnering with Local Yield teams to improve product yield, quality, performance, and reduce wafer costs.

Qualifications:

Minimum Qualifications:

Bachelor's degree in a relevant science or engineering field, with at least 3 years of semiconductor industry experience.
Experience in advanced node semiconductor industry, specifically in FEOL Process Integration
Proficient understanding of Device Physics, with experience in FinFET or Gate-All-Around technology development or high-volume manufacturing.
Familiarity with module processes such as lithography, dry etch, wet etch, CMP, diffusion, implant, thin films, and metrology.
Level of experience will be considered in determining applicants job grade.

Preferred Qualifications:

Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics, or Materials Science; related fields may be considered based on industry experience.
Experience in project/program management and/or as a TFT lead.
Strong interpersonal skills, including the ability to influence and motivate others.
Experience engaging with external foundry customers through technical interactions.
Familiarity with GAA (Gate-All-Around) technology architecture.
Background in new semiconductor technology development.
Strong problem-solving skills, self-initiative, and ability to learn independently.
Ability to collaborate effectively with multi-functional and multi-cultural teams.
Excellent communication skills.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

https://jobs.intel.com/en/benefits

Annual Salary Range for jobs which could be performed in the US:

$130,300.00-$183,950.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Average salary estimate

$157125 / YEARLY (est.)

min

max

$130300K

$183950K

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What You Should Know About FE Process Integration Engineer, Intel

Are you ready to take your career to the next level as a FE Process Integration Engineer at Intel in sunny Phoenix, Arizona? In this role, you'll be at the forefront of semiconductor manufacturing, contributing to advanced technologies that are reshaping the industry. As part of the Fab Sort Manufacturing (FSM) team, you will collaborate with fellow engineers and global yield teams to boost process optimization and achieve yield ramp-up during the crucial early production phases. Your responsibilities will include leading projects aimed at executing high-volume manufacturing yield roadmaps, working closely with technology development teams to introduce new technologies into production, and addressing yield issues through deep-dive investigations. You'll conduct feasibility studies, manage new product introductions, and strive to enhance product performance while working alongside local yield teams to improve quality and reduce wafer costs. With a minimum requirement of a bachelor’s degree in engineering or a related field and at least three years of semiconductor industry experience, this role offers an excellent opportunity for growth. If you have a passion for problem-solving and a strong understanding of device physics, especially in advanced node technologies, we want to hear from you! At Intel, you'll not only join a leading company in semiconductor innovation but also enjoy a fantastic range of benefits. Join us in pushing the boundaries of technology and making a real impact in the world!

Frequently Asked Questions (FAQs) for FE Process Integration Engineer Role at Intel

What are the key responsibilities of a FE Process Integration Engineer at Intel?

As a FE Process Integration Engineer at Intel, you will lead engineering projects that execute high-volume manufacturing yield roadmaps while closely collaborating with Technology Development and Local Yield teams to implement new technologies. Your role will also involve managing new product introductions (NPI) in production fabs and identifying root causes for yield and performance issues, all aimed at achieving optimal performance targets.