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Yield Failure Analysis Engineer

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Job Details:

Job Description:

Intel Chandler, Arizona Ocotillo Technology Fabrication (OTF) is part of Intel Foundry's Manufacturing and Supply Chain group (FMSC) and is responsible for the high-volume production of Intel silicon using the world's most advanced manufacturing processes. As part of Intel's Integrated Device Manufacturer 2.0 (IDM2.0) strategy with Foundry Capability, Intel Chandler, Arizona site is building new fabs for the latest technology nodes including Intel 18A and beyond. This exciting transformation at Intel needs talented candidates with Yield Failure Analysis experience in Foundry to service local and global customers.

Intel's Foundry Technology Development Yield organization is seeking a Yield Labs Engineer (TEM /FIB/SEM) who is passionate, innovative, and results-oriented with experience in semiconductor manufacturing equipment and systems. The individual will be expected to develop, implement, optimize, maintain, and document procedures for data storage and analysis systems and infrastructure supporting metrology equipment used for development and manufacturing for foundry customers. The engineer will work closely with equipment development, operations, automation, and manufacturing collaborators to provide quality end to end foundry solutions.

The candidate should be excited to work in a fast-paced environment where flexibility and adaptability is key to their success. Ability to learn rapidly in a complex and rapidly changing environment and to communicate effectively with co-workers and across teams is a must.

Responsibilities:

Operation and/or ownership of TEM/FIB/SEM tools to analyze defect, metrology, or failure analysis samples
Mentorship and training of FA team staff (technicians and engineers) on TEM/FIB/SEM
Knowledge and demonstration of the techniques of dual-beam or manual sample preparation for TEM/SEM
Preparing high quality analysis plans and reports for customers on findings
Working with Yield and Process Engineering on rapid problem solving through directed analysis
Development of new techniques of preparation or analysis of samples in collaboration with vendors or TD

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Bachelor’s degree in Materials Science, Physics, Engineering or related STEM fields
2+ years of hands-on experience with TEM, FIB, or SEM instrumentation in a lab or applications setting
2+ years of experience in a lab setting where samples are prepared for analysis
US citizenship required.
Ability to obtain and maintain a US Government Security Clearance

Preferred Qualifications:

MS, or PhD in Materials Science, Physics, Engineering or related STEM fields
Possibility of working a shifted schedule with at least one weekend day at least two weeks a month. (Sunday-Thursday or Tuesday-Saturday)

Knowledge of semiconductor process fundamentals and the advances in fabrication technology over the past decade
Knowledge or direct experience with general failure analysis tools in a semiconductor laboratory
Demonstrated independent quick-learning ability on lab instrumentation
Excellent verbal and written communication skills
Demonstrated ability to lead and manage lab staff
Prior experience working with US Government contracts including security and sensitive document handling and/or Top-Secret US Government clearance
Active US Government Security Clearance, with a minimum of Secret level.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:

https://jobs.intel.com/en/benefits

Annual Salary Range for jobs which could be performed in the US:

$117,140.00-$165,370.00

Salary range dependent on a number of factors including location and experience.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Average salary estimate

$141255 / YEARLY (est.)

min

max

$117140K

$165370K

If an employer mentions a salary or salary range on their job, we display it as an "Employer Estimate". If a job has no salary data, Rise displays an estimate if available.

What You Should Know About Yield Failure Analysis Engineer, Intel

Are you ready to make a significant impact in the semiconductor world? Join Intel as a Yield Failure Analysis Engineer in Phoenix, Arizona. Here at Intel's Ocotillo Technology Fabrication facility, we are on the cutting edge of technology, driving the future of semiconductor manufacturing. In this role, you’ll take ownership of sophisticated TEM, FIB, and SEM tools to delve deep into defect analysis and failure investigations for our global customers. We’re looking for someone who thrives in a dynamic environment, enjoys collaborating with diverse teams, and possesses the ability to learn rapidly, taking on new challenges every day. Your responsibilities will include developing and optimizing procedures for our data storage and analysis systems, while also mentoring team members on effective techniques for sample preparation and analysis. As you work closely with our Yield and Process Engineering teams, you’ll play a pivotal role in problem-solving and driving continuous improvement initiatives. If you have a background in Materials Science or related fields, along with hands-on lab experience, this is the perfect opportunity to grow your career in an innovative company that values creativity and contribution. Bring your passion for technology and your innate problem-solving skills to Intel, where we’re not just building chips; we’re building the future.

Frequently Asked Questions (FAQs) for Yield Failure Analysis Engineer Role at Intel

What are the primary responsibilities of a Yield Failure Analysis Engineer at Intel?

As a Yield Failure Analysis Engineer at Intel, you will operate and own TEM, FIB, and SEM tools, focusing on defect analysis and failure investigations. You'll also mentor and provide training to the team, prepare high-quality reporting for findings, and develop innovative techniques for sample preparation and analysis, ensuring continuous improvement in semiconductor manufacturing.